The global semiconductor packaging material market is projected to reach $50.6 billion by 2028, at a CAGR of 7.1% during 2023-2028. The growth of semiconductor packaging material market is driven by growing trend of miniaturization of the electronic devices across the world and high demand for mobile phones, tablets, and other communication devices.
Some of the Key Questions answered in this exclusive report are:
Q.1 What are some of the
most promising, high-growth opportunities for the semiconductor packaging
material market by product type (substrates, leadframes, bonding wires,
encapsulants, underfill materials, die attach, solder balls, wafer-level
package dielectrics, and others), technology (grid array, small outline
package, dual flat no-leads, quad flat package, dual in-line package, and
others), end use industry (consumer electronics, aerospace & defense, healthcare,
communication, automotive, and others), and region (North America, Europe, Asia
Pacific, and the Rest of the World)?
Q.2 Which segments will
grow at a faster pace and why?
Q.3 What are the
business risks and threats to the semiconductor packaging material market?
Q.4 What are some
changing demands of customers in the semiconductor packaging material market?
Q.5 What are the new
developments in the semiconductor packaging material market? Which companies
are leading these developments?
Q.6 What strategic
initiatives are being implemented by key players for business growth?
Q.7 What are some of the
competitive products and processes in this semiconductor packaging material
area and how big of a threat do they pose for loss of market share via product
substitution?
Q.8 What M&A activity has occurred in the last 5 years in this semiconductor packaging material market?
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Market Segmentation:
Based on product type,
the semiconductor packaging material market is segmented into substrates,
leadframes, bonding wires, encapsulants, underfill materials, die attach,
solder balls, wafer-level package dielectrics, and others. The substrate
segment accounted for the largest share of the market in 2023 and is expected
to register the highest CAGR during the forecast period, due to the growing
demand for system-in-package (SIP) and high-performance devices and rising
usage of this product to transmit electricity from the semiconductor to the
mainboard and secure the semiconductor from external damage.
Asia-Pacific will remain
the largest region and it is also expected to witness the highest growth over
the forecast period due to the high demand for electronic packaging materials
and for consumer electronics in China, Taiwan, and India.
Key Players in the
semiconductor packaging material market are Henkel, Hitachi Chemical Company,
Sumitomo Chemical, Kyocera Chemical, and Toray Industries.
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The report helps stakeholders understand the
pulse of the market and provides them with information on key drivers,
restraints, challenges, and opportunities for market growth. It would also help
to understand the competitors better and gain more insights to improve their
position in the business.
To read more about this market please click on
https://www.lucintel.com/semiconductor-packaging-materials-market.aspx.
About
Lucintel
Lucintel,
the premier global management consulting and market research firm, creates
winning strategies for growth. It offers market assessments, competitive
analysis, opportunity
analysis, growth
consulting, M&A, and due diligence services to executives and
key decision-makers in a variety of industries. For further information, visit www.lucintel.com.
Roy Almaguer
Lucintel
Dallas,
Texas, USA
Email: roy.almaguer@lucintel.com
Tel. 972.636.5056
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