According to the recent study the 3D semiconductor packaging market is projected to reach an estimated $8.7 billion by 2028 from $3.6 billion in 2023, at a CAGR of 19% from 2023 to 2028. Growth in this market is primarily driven by high demand for miniaturized consumer electronics, increasing sales of electric vehicles, and the requirement of less space, high efficiency, and low power loss.
A more than 150–page
report is developed to understand trends, opportunities and forecast in 3D
semiconductor packaging market by technology (3D through silicon, 3D package on
package, 3D fan out, 3D wire bonded, and others), material (organic substrates,
bonding wires, lead frames, encapsulation resin, ceramic package, die attach
materials, and others), end use industry (consumer electronics, industrial,
automotive, healthcare, IT & telecommunication, aerospace & defense,
and others), and region (North America, Europe, Asia Pacific, and the Rest of
the World).
Download sample report by clicking
on below link
https://www.lucintel.com/3d-semiconductor-packaging-market.aspx
“3D through silicon market is expected
to remain the largest segment during the forecast period.”
Based on technology, the
3D semiconductor packaging market is segmented into 3D through silicon, 3D
package on package, 3D fan out, 3D wire bonded, and others. Lucintel forecasts
that the 3D through silicon market is expected to remain the largest segment
due to its high density and short connection; hence, it is preferred over
package-on-package.
“Within the 3D semiconductor packaging market, the consumer
electronics segment is expected to remain the largest end use industry.”
Based on end use
industry the consumer electronics segment is expected to witness the highest
growth over the forecast period because increased demand for smartphones has
led to growing demand for ICs, which are their core components.
“Asia pacific will dominate the 3D semiconductor packaging market
in near future.”
Asia Pacific will remain
the largest region, and it is also expected to witness the highest growth over
the forecast period as the region has the largest semiconductor industry.
Download Brochure of this report by clicking on https://www.lucintel.com/3d-semiconductor-packaging-market.aspx.
Major players of 3D
semiconductor packaging market are adopting various growth strategies like new
product launches, expansions, merger and acquisitions, partnerships,
agreements, and collaborations to expand their presence in this market. Amkor
Technology, ASE group, Siliconware Precision Industries, Jiangsu Changjiang
Consumer, and SSS MicroTec AG are among the major 3D semiconductor packaging
providers.
This unique research
report will enable you to make confident business decisions in this globally
competitive marketplace. For a detailed table of contents, contact Lucintel at
+1-972-636-5056 or click on this link https://www.lucintel.com/3d-semiconductor-packaging-market.aspx or helpdesk@lucintel.com.
About Lucintel
At Lucintel, we offer
solutions for you growth through game changer ideas and robust market &
unmet needs analysis. We are based in
Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20
years. We are quoted in several publications like the Wall Street Journal,
ZACKS, and the Financial Times. For further information, visit www.lucintel.com.
Contact:
Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: roy.almaguer@lucintel.com
Tel. 972.636.5056
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