Lucintel's latest market report analyzed that flex-rigid FPC technology provides attractive opportunities in the computers/peripherals, telecommunications, consumer electronics, medical, automotive, and aerospace and defense end user industries. The flex-rigid FPC technology market is expected to reach $2.6 billion by 2028 with a CAGR of 7.2%. In this market, polyimide is the largest segment by laminate material type, whereas consumer electronics is largest by end use industry.
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Based on laminate
material type, the flex-rigid FPC technology market is segmented into
polyimide, polyester, and others. The polyimide segment accounted for the
largest share of the market in 2023 and is expected to register the highest
CAGR during the forecast period, due to its excellent mechanical, thermal, and
chemical properties, which make it well suited for flexible circuitry
applications and it can also withstand extreme temperatures without
degradation.
Browse in-depth TOC on
“Flex-Rigid FPC Technology Market”
100 – Figures/Tables
150 – Pages
The Flex-Rigid FPC Technology
Market is marked by the presence of several big and small players. Some of the
prominent players offering flex-rigid FPC technology include Zhen Ding
Technology Holding Limited (ZDT), NOK Corporation, Sumitomo Electric, Flexium
Interconnect, Fujikura, Nitto Denko Corporation, Interflex, Samsung
Electro-Mechanics, and Daeduck GDS.
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This unique research report will enable you
to make confident business decisions in this globally competitive marketplace. For
a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on
this link helpdesk@lucintel.com.
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Lucintel,
the premier global management consulting and market research firm, creates
winning strategies for growth. It offers market assessments, competitive
analysis, opportunity
analysis, growth
consulting, M&A, and due diligence services to executives and
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Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: roy.almaguer@lucintel.com
Tel. 972.636.5056
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