Lucintel's latest market report analyzed that 3D TSV device provides attractive opportunities in the consumer electronics, information and communication technology, automotive, military, aerospace, and defense industries. The 3D TSV Device market is expected to grow at a CAGR of 6% to 8%. In this market, advanced LED packaging is the largest segment by product type, whereas consumer electronics is largest by end use industry.
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Based on product type, the 3D TSV device market is segmented into memory,
advanced led packaging, cmos image sensors, imaging and opto-electronics, mems,
and others. The advanced LED packaging segment accounted for the largest share
of the market in 2020 and is expected to register the highest CAGR during the
forecast period, due to increasing use of light-emitting diodes (LED) in
electronic products.
Browse in-depth TOC on “3D
TSV Device Market”
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The 3D TSV Device Market
is marked by the presence of several big and small players. Some of the
prominent players offering 3D TSV device include GLOBALFOUNDRIES, Broadcom,
Intel Corporation, Invensas Corporation, Samsung Electronics,
STMicroelectronics NV, Micron Technology, Inc., Jiangsu Changing Electronics
Technology Co., Amkor Technology, Toshiba Corp., Advanced Semiconductor
Engineering Inc., United Microelectronics Corp., and Taiwan Semiconductor
Manufacturing Company Limited.
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to make confident business decisions in this globally competitive marketplace. For
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this link helpdesk@lucintel.com.
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the premier global management consulting and market research firm, creates
winning strategies for growth. It offers market assessments, competitive
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Brandon Fitzgerald
Lucintel
Dallas,
Texas, USA
Email: brandon.fitzgerald@lucintel.com
Tel. 972.636.5056
Cell: 303.775.0751
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