According to the recent study the High-Density Interconnect (HDI) PCB Market is projected to reach an estimated $21 Billion by 2030 from $15 billion in 2023 at a CAGR of 5% from 2023 to 2030. Growth in this market is primarily driven by increasing demand for miniaturization of electronic devices, growing technological advancement, and rising demand from 5G and IoT.
Browse 99 figures/charts
and 76 tables in this 199-page report to understand trends, opportunities and
forecast in high-density interconnect (HDI) PCB market by end use industry
(smartphones and tablets, computers, telecom/datacom, consumer electronics,
automotive, and others), technology (4-6 layer, 8-10 layer, and 10+ layer),
build-up structure (1+n+1, 2+n+2, 3+n+3, and others), and region (North
America, Europe, APAC and the Rest of the World).
Lucintel forecasts that
4-6 layers will remain the largest segment due to increasing demand in
smartphones and telecommunication equipment. The 10+ layer HDI PCB market is
expected to witness the highest growth during the forecast period due to the
growing demand for smart wearables and connected devices.
• Smartphones will
remain the largest end use industry due to the increasing demand for high
performance PCB and growing demand for more space in smartphones for larger
batteries. Automotive is expected to witness the highest growth over the
forecast period due to advancement in automotive electronics.
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High-Density Interconnect (HDI) PCB
Market
Asia Pacific will remain
the largest market, and it is also expected to witness the highest growth over
the forecast period due to the increasing electronic content in automotive and
growth in consumer electronic devices & telecommunication products.
TTM Technologies, Inc.,
Tripod Technology Corporation, AT&S, Kingboard Holdings Ltd., CCTC, DG
Shengyi Electronics, Dynamic Electronics Co. Ltd., Gold Circuit Electronics,
Olympic, DAP, Unimicron Technology Corp.,Compeq Manufacturing Co., Ltd., Ibiden
Co., Ltd., Zhen Ding Technology Holding Limited, Unitech, Samsung
Electro-Mechanics, and Meiko Electronics Co. Ltd. are the major supplier in the
high-density interconnect (HDI) PCB market.
This unique research
report will enable you to make confident business decisions in this globally
competitive marketplace. For a detailed table of contents, contact Lucintel at
+1-972-636-5056 or write us at helpdesk@lucintel.com
About Lucintel
At Lucintel, we offer solutions for
you growth through game changer ideas and robust market &
unmet needs analysis. We are based in
Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20
years. We are quoted in several publications like the Wall Street Journal,
ZACKS, and the Financial Times.
Contact:
Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: roy.almaguer@lucintel.com
Tel. +1 972.636.5056
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