According to the recent study the High-Density Interconnect (HDI) PCB Market is projected to reach an estimated $17.3 billion by 2028 from $15 billion in 2022, at a CAGR of 2.5% from 2022 to 2028. Growth in this market is primarily driven by growth in consumer electronics market, miniaturization of electronic devices, and increasing demand for high performance devices.
Browse 99 figures/charts
and 76 tables in this 195-page report to understand trends, opportunities and
forecast in high-density interconnect (HDI) PCB market by technology end use
industry (smartphones and tablets, computers, telecom/datacom, consumer
electronics, automotive, and others), technology (4-6 layer, 8-10 layer, and
10+ layer), build-up layer count (1+n+1, 2+n+2, 3+n+3, and others), and region
(North America, Europe, Asia Pacific, and the Rest of the World).
Download sample report by clicking
on below link:
https://www.lucintel.com/high-density-interconnect-printed-circuit-board-market.aspx
“4-6 layers market is expected to remain
the largest segment during the forecast period.”
Based on technology, the
high-density interconnect (HDI) PCB market is segmented into 4-6 layer, 8-10
layer, and 10+ layer. Lucintel forecasts that the 4-6 layers market is expected
to remain the largest segment due to increasing demand in smartphones and
telecommunication equipment.
“Within the high-density interconnect (HDI) PCB market, the smartphones
segment is expected to remain the largest end use industry.”
Based on end use
industry the smartphones segment is expected to witness the highest growth over
the forecast period due to the increasing demand for high performance PCB and
growing demand for more space in smartphones for larger batteries.
“Asia pacific will dominate the high-density interconnect (HDI)
PCB market in near future.”
Asia Pacific will remain
the largest market, and it is also expected to witness the highest growth over
the forecast period due to the increasing electronic content in automotive and
growth in consumer electronic devices & telecommunication products.
Download Brochure of this report by clicking on https://www.lucintel.com/high-density-interconnect-printed-circuit-board-market.aspx.
Major players of
high-density interconnect (HDI) PCB market are adopting various growth
strategies like new product launches, expansions, merger and acquisitions,
partnerships, agreements, and collaborations to expand their presence in this
market. TTM Technologies, Inc., Tripod Technology Corporation, AT&S,
Kingboard Holdings Ltd., CCTC, DG Shengyi Electronics, Dynamic Electronics Co.
Ltd., Gold Circuit Electronics, Olympic, DAP, Unimicron Technology Corp.,Compeq
Manufacturing Co., Ltd., Ibiden Co., Ltd., Zhen Ding Technology Holding
Limited, Unitech, Samsung Electro-Mechanics, and Meiko Electronics Co. Ltd. are
among the major high-density interconnect (HDI) PCB providers.
This unique research
report will enable you to make confident business decisions in this globally
competitive marketplace. For a detailed table of contents, contact Lucintel at
+1-972-636-5056 or click on this link https://www.lucintel.com/high-density-interconnect-printed-circuit-board-market.aspx or helpdesk@lucintel.com.
About Lucintel
At Lucintel, we offer
solutions for you growth through game changer ideas and robust market &
unmet needs analysis. We are based in
Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20
years. We are quoted in several publications like the Wall Street Journal, ZACKS,
and the Financial Times. For further information, visit www.lucintel.com.
Contact:
Roy Almaguer
Director of Client Engagements
Lucintel
Dallas, Texas, USA
Cell: 210-878-7693
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