The global substrate-like PCB market is projected to grow at
a CAGR of 15% to 17% from 2021 to 2026. The growth of substrate-like PCB market
is driven by the growing demand for smart consumer electronics and wearable
devices and high adoption by leading OEMs.
Some of the Key Questions answered in
this exclusive report are:
Q.1 What are some of the most promising potential, high-growth opportunities for the global substrate-like PCB market by line/space (25/25 & 30/30 im and less than 25/25 im), inspection technologies (automated optical inspection, direct imaging, and automated optical shaping), application (automotive, medical, computing & telecommunication, military aerospace & defense, industrial, consumer electronics), and region (North America, Europe, Asia Pacific, and the Rest of the World)?Q.2 Which segments will grow at a faster pace and why?
Q.3 What are the business risks and threats to the substrate-like PCB market?
Q.4 What are some changing demands of customers in the substrate-like PCB market?
Q.5 What are the new developments in the substrate-like PCB market? Which companies are leading these developments?
Q.6 What strategic initiatives are being implemented by key players for business growth?
Q.7 What are some of the competitive products and processes in this substrate-like PCB area and how big of a threat do they pose for loss of market share via product substitution?
Q.8 What M&A activity has occurred in the last 5 years in this substrate-like PCB market?
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Market Segmentation:
Based on inspection technologies, the substrate-like PCB market is segmented
into automated optical inspection, direct imaging, and automated optical
shaping. The automated optical inspection segment accounted for the largest
share of the market in 2020 and is expected to register the highest CAGR during
the forecast period, due to increased interest of SLP manufacturers in adopting
advanced inspection technologies and rising demand in consumer electronics,
telecommunication, and other end use industries.
Asia Pacific will remain the largest region during the forecast period due to increasing demand for connectivity solutions, expansion of telecommunications infrastructure, and increasing adoption of smartphone in this region.
Key Players in the substrate-like
PCB market are AT & S, TTM Technologies, Samsung Electro-Mechanics, Korea
Circuit, Kinsus Interconnect Technology, Zhen Ding Technology, Unimicron,
Compeq,Ibiden, Tripod Technology Corporation, and LG Innotek.
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The report helps stakeholders understand the pulse of the market and provides them with information on key drivers, restraints, challenges, and opportunities for market growth. It would also help to understand the competitors better and gain more insights to improve their position in the business.
To read more about this market please click on https://www.lucintel.com/substrate-like-pcb-market.aspx
About Lucintel
Lucintel, the premier global management consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, growth consulting, M&A, and due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.
Brandon
Fitzgerald
Lucintel
Dallas,
Texas, USA
Email: brandon.fitzgerald@lucintel.com
Tel. 972.636.5056
Cell: 303.775.0751
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