According to the recent study the molded interconnected device market is projected to grow at a CAGR of 14% to 16% from 2021 to 2026. Growth in this market is primarily driven by increasing demand of miniaturization in consumer electronics segment, increasing use in medical device, and increase in the penetration of automation around all industrial verticals.
Browse XX figures /
charts and XX tables in this 150-page report to understand trends,
opportunities and forecast in molded interconnected device market by process
(laser direct structuring, 2-shot molding, and film techniques), product type
(antenna & connectivity modules, connectors & switches, sensors,
lighting, and others), end use industry (automotive, medical,
telecommunication, consumer electronics, and industrial), and region (North America,
Europe, Asia Pacific, and the Rest of the World).
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and view detailed Table of Content by clicking on below link https://www.lucintel.com/molded-interconnected-device-market.aspx
“Laser direct structuring market is
expected to remain the largest segment during the forecast period.”
Based on process, the
molded interconnected device market is segmented into laser direct structuring,
2-shot molding, and film techniques. Lucintel forecasts that the laser direct
structuring market is expected to remain the largest segment due to rise in the
demand of smartphone antennas and emergence of 5G mobile communication
technology.
“Within the molded interconnected device market, the automotive
segment is expected to remain the largest end use industry.”
Based on end use
industry the automotive segment is expected to witness the highest growth over
the forecast period due to increasing adoption of MID in various automotive
application such as steering wheel hubs, brake sensors, position sensors, and
lighting.
“Asia pacific will dominate the molded interconnected device
market in near future.”
Asia Pacific will remain
the largest region during the forecast period due to increasing demand in
consumer electronics industries and significant presence of major leading
players of smartphones and wearable device in the APAC region.
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Major players of molded interconnected device market are adopting various growth strategies like new product launches, expansions, merger and acquisitions, partnerships, agreements, and collaborations to expand their presence in this market. Molex, MacDermid, Siemens, LPKF Laser & Electronics, Fujitsu, TE Connectivity, Harting, Select Connect Technologies, JOHNAN MID Solutions, 2E mechatronic, and Multiple Dimensions are among the major molded interconnected device providers.
This unique research report will enable you to make confident business
decisions in this globally competitive marketplace. For a detailed table of
contents, contact Lucintel at +1-972-636-5056 or click on this link https://www.lucintel.com/molded-interconnected-device-market.aspx or helpdesk@lucintel.com.
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Contact:
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Lucintel
Dallas, Texas, USA
Email: brandon.fitzgerald@lucintel.com
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