According to the recent study the advanced IC packaging market is projected to reach an estimated $50.1 billion by 2026 from $31.6 billion in 2020, at a CAGR of 8% from 2020 to 2026. Growth in this market is primarily driven by growing semiconductor industry, increasing miniaturization of electronic devices, demand for higher speed and smaller pitch size, and increasing penetration of 2.5D/3D packaging technology.
Browse 74 figures /
charts and 41 tables in this 138 -page report to understand trends,
opportunities and forecast in advanced IC packaging market by packaging type (flip-chip,
fan-in wafer level packaging, embedded-die, fan-out, and 2.5D/3D) end use
industry (consumer and communication, automotive, industrial, healthcare,
aerospace and defense, and others), and region (North America, Europe, Asia
Pacific, and the Rest of the World).
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sample report and view
detailed Table of Content by clicking on below link https://www.lucintel.com/advanced-ic-packaging-market.aspx
“Flip-chip market is expected to remain the largest segment during
the forecast period.”
Based on packaging type,
the advanced IC packaging market is segmented into flip-chip, fan-in wafer
level packaging, embedded-die, fan-out, and 2.5D/3D. Lucintel forecasts that
the flip-chip market is expected to remain the largest segment over the
forecast period due to rise in demand for high speed portable devices and
increasing need for high packaging density.
“Within the advanced IC packaging market, the consumer and
communication segment is expected to remain the largest end use industry.”
Based on end use
industry, the consumer and communication segment is expected to witness the largest
coating over the forecast period increasing demand for smartphones, connected
and high performance consumer devices with AI technology, and demand for high
performance computing are driving the demand for advanced IC packaging in the
consumer and communication market.
“Asia pacific will dominate the advanced IC packaging market in
near future.”
Asia Pacific is expected
to be the largest region with the highest growth over the forecast period due
to the presence of large foundries and manufacturing hub for electronic
devices. Economic growth, growing urbanization, growing disposable income, and
increasing adoption of digital technologies, such as 5G, Internet of things
(IoT), and artificial intelligence (AI) are driving the demand for advanced IC
packaging market in this region.
Download Brochure of this report by clicking on https://www.lucintel.com/advanced-ic-packaging-market.aspx
Major players of advanced
IC packaging market are adopting various growth strategies like new product
launches, expansions, merger and acquisitions, partnerships, agreements, and
collaborations to expand their presence in this market. Amkor, Taiwan
Semiconductor, Advanced Semiconductor Engineering Technology, Intel, and
Samsung are among the major advanced IC packaging providers.
This unique research
report will enable you to make confident business decisions in this globally
competitive marketplace. For a detailed table of contents, contact Lucintel at
+1-972-636-5056 or click on this link https://www.lucintel.com/advanced-ic-packaging-market.aspx or helpdesk@lucintel.com.
About Lucintel
At Lucintel, we offer
solutions for you growth through game changer ideas and robust market &
unmet needs analysis. We are based in
Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20
years. We are quoted in several publications like the Wall Street Journal,
ZACKS, and the Financial Times. For further information, visit www.lucintel.com.
Contact:
Brandon Fitzgerald
Lucintel
Dallas, Texas, USA
Email: brandon.fitzgerald@lucintel.com
Tel. 972.636.5056
Cell: 303.775.0751
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