According to the recent study the Advanced IC Packaging Market is projected to reach an estimated $52.3 billion by 2027 from $37.6 billion in 2021, at a CAGR of 5.7% from 2021 to 2027. Growth in this market is primarily driven by growing semiconductor industry, increasing miniaturization of electronic devices, demand for higher speed and smaller pitch size, and increasing penetration of 2.5D/3D packaging technology.
Browse 107 figures /
charts and 68 tables in this 205 -page report to understand trends,
opportunities and forecast in advanced IC packaging market by packaging type
(flip-chip, fan-in wafer level packaging, embedded-die, fan-out, 2.5D/3D) end
use industry (consumer and communication, automotive, industrial, healthcare,
aerospace and defense, and others), and region (North America, Europe, Asia
Pacific, and the Rest of the World).
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on below link https://www.lucintel.com/advanced-packaging-market.aspx
“Flip-chip market is expected to remain
the largest segment during the forecast period.”
Based on packaging type,
the advanced IC packaging market is segmented into flip-chip, fan-in wafer
level packaging, embedded-die, fan-out, 2.5D/3D. Lucintel forecasts that the flip-chip
market is expected to remain the largest segment due to rise in demand for high
speed portable devices and high packaging density.
“Within the advanced IC packaging market, the consumer and
communication segment is expected to remain the largest end use industry.”
Based on end use
industry the consumer and communication segment is expected to witness the
highest growth over the forecast period due to increasing demand for
smartphones, connected and high performance consumer devices with AI
technology, and demand for high performance computing are driving the demand
for advanced IC packaging in the consumer and communication market.
“Asia pacific will dominate the advanced IC packaging market in
near future.”
Asia Pacific will remain
the largest region over the forecast period due to the presence of large
foundries and manufacturing hub for electronic devices. Economic growth,
growing urbanization, growing disposable income, and increasing adoption of
digital technologies, such as 5G, Internet of things (IoT), and artificial
intelligence (AI) are driving the demand for advanced IC packaging market.
Download Brochure of this report by clicking on https://www.lucintel.com/advanced-packaging-market.aspx
Major players of
advanced IC packaging market are adopting various growth strategies like new
product launches, expansions, merger and acquisitions, partnerships,
agreements, and collaborations to expand their presence in this market. Amkor
Technology, Taiwan Semiconductor, Advanced Semiconductor Engineering
Technology, Intel Corporation, Samsung Electronics, JCET Group, Texas
Instruments, Toshiba Corporation, and Renesas are among the major advanced IC
packaging providers.
This unique research
report will enable you to make confident business decisions in this globally
competitive marketplace. For a detailed table of contents, contact Lucintel at
+1-972-636-5056 or click on this link https://www.lucintel.com/advanced-packaging-market.aspx or helpdesk@lucintel.com.
About Lucintel
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solutions for you growth through game changer ideas and robust market &
unmet needs analysis. We are based in
Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20 years.
We are quoted in several publications like the Wall Street Journal, ZACKS, and
the Financial Times. For further information, visit www.lucintel.com.
Contact:
Brandon Fitzgerald
Lucintel
Dallas, Texas, USA
Email: brandon.fitzgerald@lucintel.com
Tel. 972.636.5056
Cell: 303.775.0751
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