According to a market report by Lucintel, the future of the global thin wafer processing and dicing equipment market looks promising with opportunities in the memory & logic (TSV), mems device, power device, CMOS image sensor, RFID markets. The global thin wafer processing and dicing equipment market is expected to reach an estimated $2 billion by 2035 from $1 billion in 2027 with a CAGR of 6.4% from 2027 to 2035. The major drivers for this market are the increasing demand for compact semiconductor devices, the rising adoption of advanced wafer technologies, and the growing production of consumer electronic devices.
A more than 150-page report to understand trends, opportunity and
forecast in global thin wafer processing and dicing equipment market to 2035 by
equipment type (thinning equipment and dicing equipment), wafer size (<4
inch, 5-6 inch, 8 inch, and 12 inch), wafer thickness (750 µm, 120 µm, and 50
µm), application (memory and logic (TSV), MEMS devices, power devices, CMOS
image sensors, RFID, and others), and region (North America, Europe, Asia
Pacific, and the Rest of the World).
Lucintel forecasts that, within the equipment type category, dicing
equipment will remain a larger segment over the forecast period due to
increasing semiconductor manufacturing and wafer processing demand.
Within the application category, memory & logic (TSV) will remain the
largest segment over the forecast period due to rising advanced memory chip
demand.
Download sample by clicking on thin wafer processing and dicing
equipment market.
In terms of regions, APAC will remain the largest region over the
forecast period due to strong semiconductor production and expanding
fabrication facilities.
Disco Corporation, Tokyo Seimitsu Co., Ltd. (ACCRETECH), Advanced Dicing
Technologies Ltd., Plasma-Therm LLC, SPTS Technologies Ltd., Han’s Laser
Technology Industry Group Co., Ltd., ASM Laser Separation International B.V.,
Suzhou Delphi Laser Co., Ltd., Panasonic Holdings Corporation, Hitachi
High-Tech Corporation are the major suppliers in the thin wafer processing and dicing equipment market.
This
unique research report will enable you to make confident business decisions in
this globally competitive marketplace. For a detailed table of contents,
contact Lucintel at +1-972-636-5056 or write us at helpdesk@lucintel.com. To get
access of more than 1000 reports at fraction of cost visit Lucintel's Analytics
Dashboard.
About Lucintel
At Lucintel, we offer solutions for
your growth through game changer ideas and robust market &
unmet needs analysis. We are based in
Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20
years. We are quoted in several publications like the Wall Street Journal,
ZACKS, and the Financial Times.
Contact:
Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: roy.almaguer@lucintel.com
Tel. +1-972-636-5056
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