According to a market report by Lucintel, the future of the global advanced IC packaging market looks promising with opportunities in the consumer & communication, automotive, industrial, healthcare, and aerospace & defense industries. The global advanced IC packaging market is expected to reach an estimated $52 billion by 2027 from $38 billion in 2021 at a CAGR of 5.7% from 2021 to 2027. The major drivers for this market are growing semiconductor industry, increasing miniaturization of electronic devices, demand for higher speed and smaller pitch size, and increasing penetration of 2.5D/3D packaging technology.
A more
than 150-page report to understand trends, opportunity and forecast in global advanced
IC packaging market to 2030 by packaging type (flip-chip, fan-in wafer level
packaging, embedded-die, fan-out, 2.5D/3D) end use industry (consumer and
communication, automotive, industrial, healthcare, aerospace and defense, and
others), and region (North America, Europe, Asia Pacific, and the Rest of the
World).
Lucintel
forecasts that flip-chip will remain the largest segment due to rise in demand
for high speed portable devices and high packaging density.
Consumer
and communication will remain the largest end-use industry during the forecast
period. Increasing demand for smartphones, connected and high performance
consumer devices with AI technology, and demand for high performance computing
are driving the demand for advanced IC packaging in the consumer and
communication market.
Download
sample by clicking on advanced IC
packaging market.
Asia
Pacific will remain the largest region over the forecast period due to the
presence of large foundries and manufacturing hub for electronic devices.
Economic growth, growing urbanization, growing disposable income, and
increasing adoption of digital technologies, such as 5G, Internet of things
(IoT), and artificial intelligence (AI) are driving the demand for advanced IC
packaging market
Amkor
Technology, Taiwan Semiconductor, Advanced Semiconductor Engineering Technology,
Intel Corporation, Samsung Electronics, JCET Group, Texas Instruments, Toshiba
Corporation, Renesas are the major suppliers in the advanced IC packaging market.
This unique research
report will enable you to make confident business decisions in this globally
competitive marketplace. For a detailed table of contents, contact Lucintel at
+1-972-636-5056 or write us at helpdesk@lucintel.com. To get access of more than 1000 reports at fraction of cost
visit Lucintel's Analytics
Dashboard.
About Lucintel
At Lucintel, we offer solutions for
you growth through game changer ideas and robust market &
unmet needs analysis. We are based in
Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20
years. We are quoted in several publications like the Wall Street Journal,
ZACKS, and the Financial Times.
Contact:
Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: roy.almaguer@lucintel.com
Tel. +1-972-636-5056
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