According to the recent study the global interposer market is projected to reach an estimated $1,184 million by 2030 from $379 million in 2023 at a CAGR of 18% from 2023 to 2030. Growth in this market is primarily driven by growing demand for 2.5D and 3D IC packaging and the miniaturization of electronic devices.
Browse 107 figures/charts
and 68 tables in this 205-page report to understand trends, opportunities and
forecast in global interposer market by product type (2D interposer, 2.5D
interposer, and 3D interposer), application (CIS, CPU/GPU, MEMS 3D capping
interposer, RF devices, logic SoC, ASIC/FPGA, and others), and region (North
America, Europe, Asia Pacific, and the Rest of the World).
Lucintel forecasts that
ASIC/FPGA will remain the largest application during the forecast period due to
growing demand of artificial intelligence, autonomous car, and machine
learning.
2.5D interposer will
remain the largest segment due to better speed, power, heterogeneous
integration, and simplified integration properties.
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interposer market.
Asia Pacific will remain
the largest region over the forecast period due to the presence of large
foundries and manufacturing hub for electronic devices. Economic growth,
growing urbanization, growing disposable income, and increasing adoption of
digital technologies, such as 5G, Internet of things (IoT), and artificial
intelligence (AI) driving the demand for semiconductor and advance IC packaging
in this region, thereby demand for interposer will also grow.
Murata, Amkor, AGC,
Atomica, TSMC are among the major interposer providers.
This unique research
report will enable you to make confident business decisions in this globally
competitive marketplace. For a detailed table of contents, contact Lucintel at
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About Lucintel
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Contact:
Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: roy.almaguer@lucintel.com
Tel. +1-972-636-5056
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