The global outsourced semiconductor assembly and testing market is projected to reach $51 billion by 2030, at a CAGR of 4.4% during 2024-2030. The growth of outsourced semiconductor assembly and testing market is driven by increasing semiconductor content within electronics products to provide greater functionality and higher levels of performance, growth in demand for smartphones and internet connected devices, and increasing electronic content in automotive for safety, navigation, fuel efficiency, emission reduction, and entertainment system.
Some of the key questions answered in this exclusive report are:
Q.1 What are some of the
most promising potential, high growth opportunities for the global OSAT market
by service type (assembly & packaging and testing), packaging type (wire
bond, flip chip, wafer level, and others), application (automotive,
telecommunications, computing & networking, consumer electronics, and
industrial), and region (North America, Europe, Asia Pacific, and the Rest of
the World)?
Q.2 Which segments will
grow at a faster pace and why?
Q.3 What are the
business risks and threats to the outsourced semiconductor assembly and testing
market?
Q.4 What are some
changing demands of customers in the outsourced semiconductor assembly and
testing market?
Q.5 What are the new
developments in the outsourced semiconductor assembly and testing market? Which
companies are leading these developments?
Q.6 What strategic
initiatives are being implemented by key players for business growth?
Q.7 What are some of the
competitive products and processes in this outsourced semiconductor assembly
and testing area and how big of a threat do they pose for loss of market share
via product substitution?
Q.8 What M&A
activity has occurred in the last 5 years in this outsourced semiconductor
assembly and testing market?
Download sample by clicking on outsourced semiconductor assembly
and testing market.
Market Segmentation:
Based on service type,
the outsourced semiconductor assembly and testing market is segmented into assembly
& packaging and testing. The assembly & packaging segment accounted for
the largest share of the market in 2023 and is expected to register the highest
CAGR during the forecast period, due to growing demand for telecom
infrastructure and electronic products across the globe.
Asia Pacific is expected
to witness the highest growth during the forecast period due to growing
adoption of IoT (internet of things), increasing electronic content per
vehicle, and growing industrial automation in countries, such as China, Taiwan,
and India.
Key Players in the outsourced
semiconductor assembly and testing market are Advanced Semiconductor, Amkor, Jiangsu
Changjiang Electronics Technology, Siliconware Precision Industries, PTI
(Powertech Technology Inc.), United test and assembly center Ltd, King Yuan
Electronics co, Ltd., ChipMOS.
The report helps stakeholders understand the
pulse of the market and provides them with information on key drivers,
restraints, challenges, and opportunities for market growth. It would also help
to understand the competitors better and gain more insights to improve their
position in the business.
About Lucintel
At Lucintel, we offer solutions for
you growth through game changer ideas and robust market &
unmet needs analysis. We are based in
Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20
years. We are quoted in several publications like the Wall Street Journal, ZACKS,
and the Financial Times.
Contact:
Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: roy.almaguer@lucintel.com
Tel. 972.636.5056
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