An exciting new study from the team of Lucintel found that system in package (SiP) technology market is expected to reach $40.2 billion by 2028 with a CAGR of 10.2%. There are significant money making opportunities available in this market and companies planning to enter this market need to differentiate in order to maximize their return on investment.
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The system in package
(SiP) technology market is segmented based on technology, method, end use, and
region. In this market, 3D IC packaging is expected to remain the largest
technology, and consumer electronics segment is expected to remain the largest
end use. Players can benefit from the available opportunities like the growing
adoption of connected devices and increasing demand for robots so as to
automate the various workflows for better efficiency in the region.
Jiangsu Changjiang
Electronics Technology, Chipmos Technologies, Powertech Technologies, ASE Group,
Amkor Technology, and Fujitsu are some of the major players profiled in this
150 page report.
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Some of the Key Questions answered in this exclusive report are:
Q.1 What are some of the
most promising, high-growth opportunities for the system in package (SiP)
technology market by technology (2D IC packaging, 2.5D IC packaging, and 3D IC
packaging), method (wire bond and flip chip), end use (consumer electronics,
automotive, telecommunication, industrial system, aerospace and defense, and
others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2 Which segments will
grow at a faster pace and why?
Q.3 What are the
business risks and threats to the system in package (SiP) technology market?
Q.4 What are some
changing demands of customers in the system in package (SiP) technology market?
Q.5 What are the new
developments in the system in package (SiP) technology market? Which companies
are leading these developments?
Q.6 What strategic
initiatives are being implemented by key players for business growth?
Q.7 What are some of the
competitive products and processes in this system in package (SiP) technology
area and how big of a threat do they pose for loss of market share via product
substitution?
Q.8 What M&A
activity has occurred in the last 5 years in this system in package (SiP)
technology market?
This unique report from Lucintel will enable you to make
confident business decisions in this globally competitive marketplace. For a
detailed table of contents, contact Lucintel at +1-972-636-5056 or click on
this link helpdesk@lucintel.com.
About Lucintel
Lucintel,
the premier global management consulting and market research firm, creates
winning strategies for growth. It offers market assessments, competitive
analysis, opportunity
analysis, growth
consulting, M&A, and due diligence services to executives and
key decision-makers in a variety of industries. For further information, visit www.lucintel.com.
Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: roy.almaguer@lucintel.com
Tel. 972.636.5056
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