The global flexible printed circuit board market is projected to reach $24.3 billion by 2027, at a CAGR of 3.1% during 2022-2027. The growth of flexible printed circuit board market is driven by increasing demand for FPC in the telecommunication industry, growth in connected devices, and advancement in automotive electronics.
Some of the Key Questions answered in this exclusive report are:
Q.1 What are some of the
most promising, high-growth opportunities for the flexible printed circuit
board market by end use industry (computers/peripherals, telecommunication,
consumer electronics, medical, automotive, aerospace and defense, and others),
technology (single layer, double layer, multi-layer and rigid flex), laminate
material type (polyimide and polyester & others), laminate raw material
usage (polyimide films and polyester & other films), and region (North
America, Europe, Asia Pacific, and the Rest of the World)?
Q.2 Which segments will
grow at a faster pace and why?
Q.3 What are the
business risks and threats to the flexible printed circuit board market?
Q.4 What are some
changing demands of customers in the flexible printed circuit board market?
Q.5 What are the new
developments in the flexible printed circuit board market? Which companies are
leading these developments?
Q.6 What strategic
initiatives are being implemented by key players for business growth?
Q.7 What are some of the
competitive products and processes in this flexible printed circuit board area
and how big of a threat do they pose for loss of market share via product
substitution?
Q.8 What M&A
activity has occurred in the last 5 years in this flexible printed circuit
board market?
Emerging trends, which
have a direct impact on the dynamics of the industry, include miniaturization
of electronic devices and growing demand for low loss/high speed PCBs.
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Market Segmentation:
Based on technology, the
flexible printed circuit board market is segmented into single layer, double
layer, multi-layer, and rigid flex. The multi-layer segment is accounted for
the largest share of the market in 2021 due to increasing demand in the
automotive and telecommunication industries and rigid-flex substrate segment is
expected to witness the highest growth during the forecast period due to
growing demand for smartphone and display applications.
Asia Pacific is expected
to be the largest region and witness the highest growth over the forecast period due to
increasing ADAS and vehicle safety features in automotive and growth in
consumer electronic devices and telecommunication products. Increasing usage of
electric vehicles due to growing environmental concerns and regulations is also
expected to drive the demand for FPC in this region.
Key Players in the flexible
printed circuit board market are NOK Corporation, Zhen Ding Technology,
Sumitomo, Flexium Interconnect, Fujikura, Nitto Denko, Compeq Manufacturing,
Samsung Electro-Mechanics, Unimicron, and Young Poong Electronics.
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The report helps stakeholders understand the
pulse of the market and provides them with information on key drivers,
restraints, challenges, and opportunities for market growth. It would also help
to understand the competitors better and gain more insights to improve their position
in the business.
To read more about this market please click on
https://www.lucintel.com/flexible-printed-circuit-board-market.aspx
About
Lucintel
Lucintel,
the premier global management consulting and market research firm, creates
winning strategies for growth. It offers market assessments, competitive
analysis, opportunity
analysis, growth
consulting, M&A, and due diligence services to executives and
key decision-makers in a variety of industries. For further information, visit www.lucintel.com.
Brandon
Fitzgerald
Lucintel
Dallas,
Texas, USA
Email: brandon.fitzgerald@lucintel.com
Tel. 972.636.5056
Cell: 303.775.0751
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