According to the recent study the Flexible Printed Circuit Board (FPC) Market is projected to reach an estimated $23 billion by 2030 at a CAGR of 3.2% from 2023 to 2030. Growth in this market is primarily driven by increasing demand for FPC in the telecommunication industry, growth in connected devices, and advancement in automotive electronics.
Browse 122 figures/charts
and 134 tables in this 197-page report to understand trends, opportunities and
forecast in flexible printed circuit board (FPC) market by end use industry (computers/peripherals,
telecommunication, consumer electronics, medical, automotive, aerospace and
defense, and others), technology (single layer, double layer, multi-layer and
rigid flex), laminate material type (polyimide and polyester & others), laminate
raw material usage (polyimide films and polyester & other films), and
region (North America, Europe, Asia Pacific, and the Rest of the World).
Lucintel forecasts that
multi-layer will remain the largest technology type due to increasing demand in
the automotive and telecommunication industries. The rigid-flex substrate
segment is expected to witness the highest growth during the forecast period
due to growing demand for smartphone and display applications.
Telecommunication will
remain the largest end use industry, supported by increasing demand for
smartphones, data storage, 5G technology, and network solution sectors. The
medical end use market is expected to witness the highest growth during the
forecast period because it will witness increasing demand for portable,
wireless, and more complex electronic assemblies.
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Flexible Printed Circuit Board (FPC)
Market
Asia Pacific is expected
to remain the largest market and witness the highest growth over the forecast
period due to increasing ADAS and vehicle safety features in automotive and
growth in consumer electronic devices and telecommunication products.
Increasing usage of electric vehicles due to growing environmental concerns and
regulations is also expected to drive the demand for FPC in this region.
Zhen Ding Technology
Holding Limited (ZDT), NOK Corporation, Sumitomo Electric, Flexium Interconnect
Inc., Fujikura Ltd., Nitto Denko Corporation, Interflex, Samsung
Electro-Mechanics, Daeduck GDS, Compeq Samtec Inc are the major suppliers in
the flexible printed circuit board (FPC) market.
This unique research
report will enable you to make confident business decisions in this globally
competitive marketplace. For a detailed table of contents, contact Lucintel at
+1-972-636-5056 or write us at helpdesk@lucintel.com
About Lucintel
At Lucintel, we offer solutions for
you growth through game changer ideas and robust market &
unmet needs analysis. We are based in
Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20
years. We are quoted in several publications like the Wall Street Journal,
ZACKS, and the Financial Times.
Contact:
Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: roy.almaguer@lucintel.com
Tel. +1 972 636 5056
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