According to the recent study the wafer level packaging in the global OSAT market is projected to reach an estimated $2.1 billion by 2028 from $1.3 billion in 2023, at a CAGR of 9.4% from 2023 to 2028. Growth in this market is primarily driven by growing demand of wearable electronics and IoT products and escalating need for this packaging for gadgets including transistors, microphones, pressure sensors, accelerometers, gyroscopes, and capacitors.
A more than 150–page
report is developed to understand trends, opportunities and forecast in wafer
level packaging in the global OSAT market by service type (assembly &
packaging and testing), application (automotive, telecommunications, computing
& networking, consumer electronics, and industrial), and region (North
America, Europe, Asia Pacific, and the Rest of the World).
Download sample report by clicking
on below link
https://www.lucintel.com/wafer-level-packaging-in-osat-market.aspx
“Assembly & packaging market is
expected to remain the largest segment during the forecast period.”
Based on service type,
the wafer level packaging in the global OSAT market is segmented into assembly
& packaging and testing. Lucintel forecasts that the assembly &
packaging market is expected to remain the largest segment due to the growing
trend for electrical devices that are compact, high-performing and inexpensive.
“Within the wafer level packaging in the global OSAT market, the consumer
electronics segment is expected to remain the largest application.”
Based on application the
consumer electronics segment is expected to witness the highest growth over the
forecast period due to the on-going technological advancement in electronic
packaging process, which results in development of highly efficient electrical
interconnection techniques for electronic products.
“Asia pacific will dominate the wafer level packaging in the
global OSAT market in near future.”
APAC will remain the
largest region due to increasing export opportunities for consumer electronics
and presence of largest manufacturing units in Taiwan.
Download Brochure of this report by clicking on https://www.lucintel.com/wafer-level-packaging-in-osat-market.aspx.
Major players of wafer
level packaging in the global OSAT market are adopting various growth
strategies like new product launches, expansions, merger and acquisitions,
partnerships, agreements, and collaborations to expand their presence in this
market. ASML Holding, Fujitsu, Toshiba, Qualcomm, and Amkor Technology are
among the major wafer level packaging in the global OSAT providers.
This unique research report
will enable you to make confident business decisions in this globally
competitive marketplace. For a detailed table of contents, contact Lucintel at
+1-972-636-5056 or click on this link https://www.lucintel.com/wafer-level-packaging-in-osat-market.aspx or helpdesk@lucintel.com.
About Lucintel
At Lucintel, we offer
solutions for you growth through game changer ideas and robust market &
unmet needs analysis. We are based in
Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20
years. We are quoted in several publications like the Wall Street Journal,
ZACKS, and the Financial Times. For further information, visit www.lucintel.com.
Contact:
Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: roy.almaguer@lucintel.com
Tel. 972.636.5056
Related reports
Micro
Integrated Circuit Market:
For more details click here https://www.lucintel.com/micro-integrated-circuit-market.aspx
High
Reliability Semiconductor Market:
For more details click here https://www.lucintel.com/high-reliability-semiconductor-market.aspx
Smart Indoor Lighting Market:
For more details click here https://www.lucintel.com/smart-indoor-lighting-market.aspx
Smart High Intensity Discharge Lamp Lighting Market:
For more details click here https://www.lucintel.com/smart-high-intensity-discharge-lamp-lighting-market.aspx
Wireless Technology in the Global Smart Lighting
Market:
For more details click here https://www.lucintel.com/wireless-technology-in-smart-lighting-market.aspx
Wired Technology in the Global Smart Lighting Market:
For more details click here https://www.lucintel.com/wired-technology-in-smart-lighting-market.aspx
Paper
and Plastic Film Capacitor Market:
For more details click here https://www.lucintel.com/paper-and-plastic-film-capacitor-market.aspx
Multilayer Ceramic Capacitor Market:
For more details click here https://www.lucintel.com/multilayer-ceramic-capacitor-market.aspx
Smart
Outdoor Lighting Market:
For more details click here https://www.lucintel.com/smart-outdoor-lighting-market.aspx
Analog Integrated Circuit Market:
No comments:
Post a Comment