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Thursday, April 29, 2021

Lucintel Forecasts 3D IC and 2.5D IC Market to Grow at a CAGR of 37%-39%

According to the recent study the 3D IC and 2.5D IC market is projected to grow at a CAGR of 37%-39% from 2020 to 2025. Growth in this market is primarily driven by increasing demand for advanced architecture in electronics products and miniaturization of electronic devices.

Browse XX figures / charts and XX tables in this 150 -page report to understand trends, opportunities and forecast in 3D IC and 2.5D IC market by technology (3D wafer-level chip-scale packaging, 3D TSV, and 2.5D), end use industry (consumer electronics, telecommunication, industrial, automotive, military and aerospace, smart technologies, medical devices), application (logic, imaging & optoelectronics, memory, MEMS/sensors, LED, and power, analog & mixed signal, RF, photonics), and region (North America, Europe, Asia Pacific, and the Rest of the World).

Download sample report by clicking on below link https://www.lucintel.com/downloadreportbrochure.aspx?RepId=RPT10291 and view detailed Table of Content here – https://www.lucintel.com/3d-ic-and-2-5d-ic.aspx

“Logic market is expected to remain the largest segment during the forecast period.”

Based on application, the 3D IC and 2.5D IC market is segmented into logic, imaging and optoelectronics, memory, MEMS/sensors, LED, and power, analog and mixed signal, RF, photonics. Lucintel forecasts that the logic market is expected to remain the largest segment over the forecast period due to growing demand for 3D IC and 2.5D IC owing to high product availability. 

“Asia Pacific will dominate the 3D IC and 2.5D IC market in near future.”

Asia Pacific is expected to be the largest region over the forecast period due to growing demand for 3D IC and 2.5D IC in various consumer electronics products.

Download Brochure of this report by clicking on https://www.lucintel.com/3d-ic-and-2-5d-ic.aspx

Major players of 3D IC and 2.5D IC market are adopting various growth strategies like new product launches, expansions, merger and acquisitions, partnerships, agreements, and collaborations to expand their presence in this market. Taiwan Semiconductor Manufacturing Company Ltd., Samsung Electronics, Toshiba Corp., Advanced Semiconductor Engineering Group, and Amkor Technology are among the major 3D IC and 2.5D IC providers.

This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link https://www.lucintel.com/3d-ic-and-2-5d-ic.aspx or helpdesk@lucintel.com

About Lucintel                                                 

At Lucintel, we offer solutions for you growth through game changer ideas and robust market & unmet needs analysis. We are based in Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20 years. We are quoted in several publications like the Wall Street Journal, ZACKS, and the Financial Times. For further information, visit www.lucintel.com

Contact:
Brandon Fitzgerald
Lucintel
Dallas, Texas, USA
Email:
brandon.fitzgerald@lucintel.com
Tel. 972.636.5056
Cell: 303.775.0751

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