According to
a new market report published by Lucintel, the future of the high-density
interconnect (HDI) PCB market looks promising with opportunities in the
smartphone, computer, telecommunication equipment, consumer electronics, and
automotive industries. The global HDI PCB market is expected to reach an
estimated $15.6 billion by 2024 with a CAGR of 8% from 2019 to 2024. The major
drivers for this market are growth in consumer electronics market, miniaturization
of electronic devices, and increasing demand for high performance devices.
In this
market, 4-6 layers, 8-10 layers, and more than 10 layers (10+ layers) HDI PCBs
are used in a wide range of electronic components. Lucintel forecasts that 4-6 layers
will remain the largest product type due to increasing demand in smartphone and
telecommunication equipment. The 10+ layer HDI PCB is expected to witness the
highest growth during the forecast period due to the growing demand for smart
wearable and connected devices.
Within HDI
PCB market, smartphone will remain the largest end use industry due to the increasing
demand for high performance PCB and growing demand for more space in smartphones
for larger batteries. Automotive is expected to witness the highest growth over
the forecast period due to advancement in automotive electronics.
Asia Pacific will remain the largest market
and it is also expected to witness the highest growth over the forecast period due to the increasing electronic content in
automotive and growth in consumer electronic devices & telecommunication
products.
Emerging
trends, which have a direct impact on the dynamics of the industry, include
miniaturization of electronic devices and growing demand for low
loss/high-speed HDI PCBs. Unimicron, AT&S, Samsung Electro-Mechanics,
Tripod, Compeq, Unitech, NOK Corporation, Zhen Ding Technology, Flexium Interconnect,
Fujikura, Nitto Denko, and Young Poong Electronics are among the major
manufacturers of HDI PCBs.
Lucintel, a
leading global strategic consulting and market research firm, has analyzed growth opportunities in the
global HDI PCB market by end use industry, technology, buildup layer count, and
region. Lucintel has prepared a comprehensive research report entitled "Growth
Opportunities in the Global HDI PCB Market 2019-2024: Trends, Forecast, and
Opportunity Analysis."
This Lucintel report serves as a catalyst for growth strategy as it provides
comprehensive data and analysis on trends, key drivers, and directions. The
study includes a forecast for the global HDI PCB market by end use industry, by
technology, by build-up layer count, and region as follows:
By End Use Industry [$M and Thousand Sqm
shipment analysis for 2013 – 2024]:
- Smartphone
- Computer
- Telecommunication Equipment
- Consumer Electronics
- Automotive
- Others
By Product [$M and Thousand Sqm shipment analysis
for 2013 – 2024]:
- 4-6
Layer
- 8-10
Layer
- 10+ Layer
By Build-up
layer count [$M and Thousand Sqm shipment analysis for 2013 – 2024]:
- 1+n+1
- 2+n+2
- 3+n+3
- Others
By Region [$M and Thousand Sqm shipment
analysis for 2013 – 2024]:
·
North America
– United
States
– Canada
– Mexico
·
Europe
– Germany
– France
– UK
·
Asia Pacific
– China
– Japan
– South
Korea
– India
– Taiwan
·
Rest of the World
This 200-page research report will enable you
to make confident business decisions in this globally competitive marketplace.
For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit
us at helpdesk@lucintel.com. Lucintel offerings include Telecommunication
Report, Telecommunication
Market Report, Opportunity
Screening and Analysis, Capital
Investment Feasibility and SWOT Matrix.
About Lucintel
Lucintel, the premier global management
consulting and market research firm, creates winning strategies for growth. It
offers market assessments, competitive analysis, opportunity analysis, growth
consulting, M&A, and due diligence services to executives and key decision-makers
in a variety of industries. For further information, visit www.lucintel.com.
This
report answers following 11 key questions:
Q.1 What are
some of the most promising potentials, high-growth opportunities for the global
HDI PCB market by end-use industry (smartphone, computer and tablets,
telecommunication, consumer electronics, automotive and others), technology
(4-6 Layer, 8-10 Layer, 10+ Layer), build-up layer count (1+n+1,2+n+2,3+n+3, any
layer), and region (North America, Europe, Asia Pacific, and the Rest of the
World)?
Q. 2 Which segments will grow at a faster pace
and why?
Q.3 Which regions will grow at a faster pace
and why?
Q.4 What are the key factors affecting market
dynamics? What are the drivers and challenges of the market?
Q.5 What are the business risks and threats to
the market?
Q.6 What are emerging trends in this market
and the reasons behind them?
Q.7 What are some changing demands of
customers in the market?
Q.8 What are the new developments in the
market? Which companies are leading these developments?
Q.9 Who are the major players in this market?
What strategic initiatives are being implemented by key players for business
growth?
Q.10 What are some of the competitive products
and processes in this area and how big of a threat do they pose for loss of
market share via material or product substitution?
Q.11 What M & A activities have taken
place in the last 5 years in this market?
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