According to
a new market report published by Lucintel, the future of the low dielectric
resin market looks promising with opportunities in the PCB, wire & cable,
antenna, microelectronics, and radome applications. The global low dielectric
resin market is expected to grow at a CAGR of 4.6% from 2018 to 2023. The major
growth drivers for this market are increasing demand for high performance PCB
and growth in wire & cable market.
In this market, fluoropolymer, cyanate ester,
cyclic olefin copolymer, m-PPE, polyimide, and PET resins are used in low dielectric applications. Lucintel
forecasts that fluoropolymer will remain the largest resin type and witness the
highest growth over the forecast period supported by increase in demand for high performance PCB, wire & cable,
and antenna applications.
Within the low dielectric resin market, PCB will
remain the largest application during the forecast period due to increase in
demand of high performance PCB in communication, defense, aerospace, and marine
industries. Lucintel predicts that the antenna application is expected to
witness the highest growth over the
forecast period due to high growth in communication, portable and military
devices.
Asia Pacific
is expected to remain the largest market and witness the highest growth over
the forecast period supported by due to increasing production of electrical and
electronics devices in China, South Korea, Taiwan, and Japan.
Emerging trends, which have a direct impact
on the dynamics of the industry, include increasing uses of low dielectric resin in microfluidic chips
for medical device and low dielectric resin in high speed PCBs for low signal
loss and high frequency. Huntsman, Lonza Group, Zeon, SABIC, and
Chemours are among the major manufactures of low dielectric resin.
Lucintel, the
leading global strategic consulting and market research firm, has analyzed growth opportunities in the
global low dielectric resin market by resin type, by application, and region.
Lucintel has prepared a comprehensive research report entitled “Growth
Opportunities in the Global Low Dielectric Resin Market 2018-2023: Trends,
Forecast, and Opportunity Analysis.” This Lucintel report serves
as a catalyst for growth strategy as it provides comprehensive data and
analysis on trends, key drivers, and directions. The study includes a forecast
for the global low dielectric resin market by application, by resin type, and
region as follows:
By Resin Type [Volume (M lbs) and $M shipment analysis for 2012 –
2023]:
- Fluoropolymer
- Cyanate Ester
- Cyclic Olefin Copolymer
- m-PPE
- Polyimide
- PET
- Others
By Application [Volume (M lbs) and $M shipment
analysis for 2012 – 2023]:
- PCB
- Wire
& Cable
- Antenna
- Microelectronics
- Radome
- Others
By Region [Volume (M lbs) and $M shipment
analysis for 2012 – 2023]:
·
North America
−
US
−
Canada
−
Mexico
·
Europe
−
Germany
−
United Kingdom
−
France
·
Asia Pacific
−
China
−
South Korea
−
Taiwan
−
Japan
−
India
·
The Rest of the World
−
Central and South America
−
Middle East and Africa
This
226-page research report will enable you to make confident business decisions
in this globally competitive marketplace. For a detailed table of contents,
contact Lucintel at +1-972-636-5056 or helpdesk@lucintel.com. Lucintel offerings include Chemical Market Research Reports, Chemical Industry Analysis Report, Opportunity Screening and Analysis, Strategic Growth Consulting and Capital Investment Analysis.
About
Lucintel
Lucintel,
the premier global management consulting and market research firm, creates
winning strategies for growth. It offers market assessments, competitive
analysis, opportunity analysis, growth consulting, M&A, and due diligence
services to executives and key decision makers in a variety of industries. For
further information, visit www.lucintel.com.
This
report answers following 11 key questions:
Q.1 What are some of the most promising
potential, high-growth opportunities for the global low dielectric resin market
by resin type (fluoropolymer, cyanate ester, cyclic olefin copolymer, m-PPE,
polyimide, PET, and others), application (PCB, wire & cable, antenna,
microelectronics, radome, and others), and region (North America, Europe, Asia
Pacific, and the Rest of the World)?
Q. 2 Which segments will grow at a faster pace
and why?
Q.3 Which regions will grow at a faster pace
and why?
Q.4 What are the key factors affecting market
dynamics? What are the drivers and challenges of the market?
Q.5 What are the business risks and threats to
the market?
Q.6 What are emerging trends in this market
and the reasons behind them?
Q.7 What are the changing demands of customers
in the market?
Q.8 What are the new developments in the
market? Which companies are leading these developments?
Q.9 Who are the major players in this market?
What strategic initiatives are being implemented by key players for business
growth?
Q.10 What are some of the competitive products
and processes in this area and how big of a threat do they pose for loss of
market share via material or product substitution?
Q.11 What M & A activities have taken
place in the last 5 years in this market?
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